2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

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City: Shenzhen

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2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

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2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; ...

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FR4 BGA Substrate

DRAM Memory Chip BGA Substrate

FCBGA Package Substrate

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